University of Nottingham Malaysia
Faculty of Engineering
     
  
 

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How Ho Cheng

Associate Professor,

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Biography

Ir. Dr. How Ho Cheng graduated with his BEng (Hons) and PhD degrees in mechanical engineering from University of Strathclyde, Scotland, United Kingdom in 1994 and 1998, respectively. He is a chartered engineer registered under Engineering Council of United Kingdom, and also a professional engineer with Board of Engineers Malaysia.

Ir. Dr. How pursued his career in a high-paced semiconductor industry upon his graduation, and has extensive experience in both upstream wafer fabrication process, and downstream assembly and test of advanced packaging microprocessor device. He has established his areas of expertise in advanced packaging and assembly materials development, failure and root cause analysis, materials characterization techniques, and yield improvement methodology for a high-volume manufacturing environment.

During his tenure in the industry, Ir. Dr. How was actively engaged himself in research collaboration with universities, as well as being a guest lecturer. With his growing passion in teaching and in developing future young engineers, he eventually committed himself as a full-time academician in December 2013..

Expertise Summary

Advanced packaging and assembly materials development; failure and root cause analysis; materials characterization techniques; and yield improvement methodology for a high-volume manufacturing environment.

Teaching Summary

Materials and Manufacturing; Design, Manufacture and Project; Making Metals Perform; Additive Manufacturing and 3D Printing; MEng/BEng Individual Project

Faculty of Engineering

University of Nottingham Malaysia
Jalan Broga, 43500 Semenyih
Selangor Darul Ehsan
Malaysia

telephone: +6 (03) 8924 8000
fax: +6 (03) 8924 8001

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